v7.11.001 HSLS01 - Thin square plate subjected to a thermal gradient in thickness

Summary

The purpose of this test is to validate thermal expansion in plate elements, where the temperature varies in thickness.

Two models make it possible to test models DKT, DST, Q4G on cells TRIA3 and QUAD4 and COQUE_3D on meshes TRIA7 and QUAD9.

• 1. Reference problem
  • 1.1. Geometry
  • 1.2. Material properties
  • 1.3. Boundary conditions and loads
• 2. Benchmark solution
  • 2.1. Calculation method used for the reference solution
  • 2.2. Benchmark results
  • 2.3. Uncertainty about the solution
  • 2.4. Bibliographical references
• 3. Modeling A
  • 3.1. Characteristics of modeling
  • 3.2. Tested sizes and results
  • 3.3. notes
• 4. B modeling
  • 4.1. Characteristics of modeling
  • 4.2. Tested sizes and results
• 5. Summary of results